Work

Comparing Electromigration in Tin-Bismuth Alloys using planar geometry solder joints

Year: 2024

Type: conference-paper

Source: International Conference on Electronics Packaging (ICEP)

DOI: 10.23919/icep61562.2024.10535675

Authors: Prabjit Singh, L. Palmer, T. Wassick, M Hamid, Eric Campbell, R. F. Aspandiar, B. Franco, H. Fu, Richard Coyle, V. Vasudevan, A. Allen, K. Howell, K. Murayama, H. Zhang, A. Lifton, T. Munson, S. Middleton, M. Sarangapani

Institutions: IBM (United States), Intel (United States), DELL (United States), Hewlett-Packard (United States), NIHON SUPERIOR CO., LTD. (Japan), Shinko Electric Industries (Japan), Indium Corporation (United States), Foresite (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4399075044

FWCI: 2.275

Cites: 8

Cited by: 3

Related to: 10