Work

Analyzing the Use of Temperature to Facilitate Fault Propagation in ReRAMs

Year: 2024

Type: conference-paper

Source: IEEE Latin American Test Symposium (LATS)

DOI: 10.1109/lats62223.2024.10534600

Authors: T. S. Copetti, A. Chordia, M. Fieback, M. Taouil, S. Hamdioui, L. M. Bolzani Poehls

Institutions: RWTH Aachen University, Delft University of Technology

Language: English

Topic: VLSI and Analog Circuit Testing

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4399113929

FWCI: 0.846

Cites: 21

Cited by: 3

Related to: 10