Using statistical models for optimal packaging in semiconductor manufacturing processes
Year: 2024
Type: article
Authors: Dongguen Kim, Heejin Kim, Yejin Kim, Minwoo Chae, Young Myoung Ko, Young-Mok Bae, Hyungsub Sim, Young Chan Oh, Keum Hwan Noh
Language: English
Subfield: Control and Systems Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G1879426595, G2652665704, G4359304099
OpenAlex ID: W4401400296
