Work

Practical Application of Liquid Compression Mold Underfill

Year: 2024

Type: article

Source: Journal of The Japan Institute of Electronics Packaging

DOI: 10.5104/jiep.27.561

Author: Tsuyoshi Kamimura

Institution: Namics Corporation (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4402083492

FWCI:

Cites: 3

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Related to: 10