Work

Development of Resin Insulation Structure for 1,200 V Class Double-Sided Direct Cooling Power Module for Electric Vehicle

Year: 2024

Type: article

Source: Journal of The Japan Institute of Electronics Packaging

DOI: 10.5104/jiep.jiep-d-24-00015

Authors: Nobutake Tsuyuno, Junpei Kusukawa, Takeshi Tokuyama, Akira Matsushita, Kinya Nakatsu, Toshiaki Ishii

Institutions: Hitachi (Japan), Hitachi Astemo (Japan)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4402564581

FWCI:

Cites: 2

Cited by:

Related to: 10