Work

Thermal Cycling Reliability Analysis of 2.5D Chiplet Based on Silicon Interposer

Year: 2024

Type: conference-paper

DOI: 10.1109/aces-china62474.2024.10699555

Authors: Xiang Li, Xiangkun Yin, Xiangyu Ma, Siquan Lyu

Institution: Xidian University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Fundamental Research Funds for the Central Universities, Research and Development

OpenAlex ID: W4403124067

FWCI: 0.806

Cites: 10

Cited by: 1

Related to: 10