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Physical-Aware Interconnect Test for Multi-Die Systems Using 3Dblox Open Standard

Year: 2024

Type: conference-paper

Source: Proceedings/Proceedings - International Test Conference

DOI: 10.1109/itc51657.2024.00068

Authors: Sandeep Kumar Goel, Ankita Patidar, Moiz Khan, Frank Lee, Anshuman Chandra, Martin Keim, Naim Lemar, Jonathan Gaudet, Quoc Phan, Vidya Neerkundar

Institutions: Taiwan Semiconductor Manufacturing Company (United States), Taiwan Semiconductor Manufacturing Company (Taiwan)

Language: English

Topic: VLSI and Analog Circuit Testing

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404848134

FWCI: 1.609

Cites: 11

Cited by: 5

Related to: 10