Work

Handling Die-to-Die I/O Pads for 3DIC Interconnect Tests

Year: 2024

Type: conference-paper

Source: Proceedings/Proceedings - International Test Conference

DOI: 10.1109/itc51657.2024.00018

Authors: Sandeep Kumar Goel, Moiz Khan, Ankita Patidar, Frank Lee, Vuong Nguyen, Bharath Shankaranarayanan, Doo Kim, Manish Arora

Institutions: Taiwan Semiconductor Manufacturing Company (United States), Taiwan Semiconductor Manufacturing Company (Taiwan), Synopsys (United States)

Language: English

Topic: VLSI and Analog Circuit Testing

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404848495

FWCI:

Cites: 5

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Related to: 10