Work

Scan SerDes* for Multi-die Packages

Year: 2024

Type: conference-paper

Source: Proceedings/Proceedings - International Test Conference

DOI: 10.1109/itc51657.2024.00054

Authors: Saurabh Upadhyay, Ahmet Tokuz

Institution: Advanced Micro Devices (United States)

Language: English

Topic: VLSI and Analog Circuit Testing

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4404849303

FWCI: 0.322

Cites: 1

Cited by: 1

Related to: 10