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Extreme Temperature Automotive Testing

Year: 2024

Type: conference-paper

DOI: 10.1109/dttis62212.2024.10780427

Authors: Ben Lok, Si Diep, Thomas Pham, Nicholas Madrid, Mit Shah, Andrew Westall, Hamzeh Dessouki, Linh Truong, Andrew Davis

Institutions: Teradyne (United States), Microsoft (United States), Texas Instruments (United States)

Language: English

Topic: VLSI and Analog Circuit Testing

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405362033

FWCI: 0.322

Cites:

Cited by: 1

Related to: 10