Work

Review of TSVs Testing Between Chiplets

Year: 2024

Type: conference-paper

Source: International Conference on Integrated Circuits and Microsystems (ICICM)

DOI: 10.1109/icicm63644.2024.10814492

Authors: Mengfan Wei, Suning Ji, Dazhi Yang

Institution: Nanjing University of Posts and Telecommunications

Language: English

Topic: VLSI and Analog Circuit Testing

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405936334

FWCI: 0.644

Cites: 19

Cited by: 2

Related to: 10