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Copper Migration into Epoxy at High Temperature: Its Reason, Effect, and Way to Reduce It

Year: 2025

Type: article

Source: Journal of The Japan Institute of Electronics Packaging

DOI: 10.5104/jiep.28.190

Author: Shuaijie Zhao

Institution: Fuji Electric (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408056941

FWCI:

Cites: 6

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Related to: 10