Work

Influence of Flow Rate and Current Density on Copper Deposition in Through Hole

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909809

Authors: Barry Zeng, Rick Ye, Yu-Cheng Pai, Yu-Po Wang

Institution: Siliconware Precision Industries (Taiwan)

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408326116

FWCI:

Cites: 4

Cited by:

Related to: 10