Work

Digital Twins for IC Packages and Electronics-enabled Systems

Year: 2024

Type: conference-paper

Source: IEEE Smart World Congress (SWC)

DOI: 10.1109/swc62898.2024.00325

Authors: Adwait Inamdar, Przemyslaw Gromala, Christopher Bailey, Luu Nguyen, Benson Chan, Jong Ryu, Farnood Rezaie, Abram Detofsky, Willem D. Van Driel, GuoQi Zhang

Institutions: Delft University of Technology, Robert Bosch (Germany), Arizona State University, PsiQuantum (United States), Binghamton University, North Carolina State University, Cisco Systems (United States), Intel (United States)

Language: English

Topic: Digital Transformation in Industry

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408795113

FWCI: 0.722

Cites: 16

Cited by: 1

Related to: 10