Work

On-Chip Circuit Harness Enabling Probe-Less, Position-Invariant and Massive Testing of Chiplets via Die Front/Back-Side Capacitive Coupling

Year: 2025

Type: conference-paper

Source: IEEE Custom Integrated Circuits Conference (CICC)

DOI: 10.1109/cicc63670.2025.10983320

Authors: Neelkamal Semwal, Luigi Fassio, Massimo Alioto

Institution: National University of Singapore

Language: English

Topic: VLSI and Analog Circuit Testing

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410493045

FWCI:

Cites: 8

Cited by:

Related to: 10