Work

Void Formation Analysis in the Molded Underfill Process for Flip-Chip Packaging

Year: 2025

Type: article

Abstract: Flip-chip technology is widely used in integrated circuit (IC) packaging. Molded underfill transfer molding is the most common process for these products, as the chip and solder bumps must be protected by the encapsulating ma... | Find, read and cite all the research you need on Tech Science Press

Source: Computers, materials & continua/Computers, materials & continua (Print)

DOI: 10.32604/cmc.2025.065330

Authors: Ian Hu, Tzu-Chun Hung, Mu-Heng Zhou, Heng-Sheng Lin, Dao-Long Chen

Institution: National Kaohsiung University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: diamond

OpenAlex ID: W4410526181