Work

A Novel Adaptive Fitting and Trimming Algorithm of Chip Power Module Based on WaferLevel Packaging

Year: 2025

Type: article

Source: IEEE Transactions on Instrumentation and Measurement

DOI: 10.1109/tim.2025.3573375

Authors: Guochun Wan, Huiling Zhang, Yaming Xie

Institution: Tongji University

Language: English

Topic: VLSI and Analog Circuit Testing

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

Open Access status: closed

Funder: Tongji University

Award: G4149428880

OpenAlex ID: W4410738727

FWCI: 2.106

Cites: 26

Cited by: 3

Related to: 10