Work

Ring Oscillator-Based PreBond TSV Testing Method With Classification and Grading of Defects

Year: 2025

Type: article

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

DOI: 10.1109/tcad.2025.3580310

Authors: Xianrui Dou, Huaguo Liang, Zhengfeng Huang, Yingchun Lu, Tian Chen, Jun Liu

Institution: Hefei University of Technology

Language: English

Topic: VLSI and Analog Circuit Testing

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Ministry of Education, National Natural Science Foundation of China

Awards: G2595105183, G2747975400, G7374840570, G8535651277

OpenAlex ID: W4411337001

FWCI:

Cites: 22

Cited by:

Related to: 10