Modular Integration of Sensor-Chiplets Using Rapid Prototyping Including Interconnects and Protective Waveguide Packaging
Year: 2025
Type: conference-paper
Institution: Fraunhofer Institute for Photonic Microsystems
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4416137158