Work

Low Insertion Force Compliant Pin Connector Assembly Challenge and Solution

Year: 2017

Type: article

Source: Regional Events

DOI: 10.37665/recvboq32590

Authors: Theron Lewis, Wayne Zhang, Ben Wu, Robin Hou, Queena Zhao, Kiwi Yu, Alec Chen, Byron Tan, Jimmy Zhao

Institution: IBM (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4416885920

FWCI:

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