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Theron Lewis
Institution:
IBM (United States)
Observed institutions:
IBM (United States),
IBM (Canada),
IBM Research (China)
OpenAlex ID:
A5109851168
Large Form Factor Hybrid LGA Interconnects; Recent Applications and Technical Learning
2014
·
John Torok
, Brian Beaman
, et al.
·
IMAPSource Proceedings
·
5
A New Assessment of Multilayer Ceramic Capacitor Crack Severity
2026
·
Theron Lewis
, Jim Bielick
, et al.
·
Pan Pacific Symposium
·
1
Resilient Manufacturing Test via Shift-Left Planning, Risk-Based Review, VSM, and AI
2025
·
Zhipeng Wang (Grady)
, Weifeng Zhang (Wayne)
, et al.
·
SMTA International
Creep Corrosion Testing of Conformally Coated PCBs
2025
·
Theron Lewis
, Eric Campbell
, et al.
·
Cleaning and Coating Conference
Low Insertion Force Compliant Pin Connector Assembly Challenge and Solution
2017
·
Theron Lewis
, Wayne Zhang
, et al.
·
Regional Events
Via-in-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware
2017
·
Matt Kelly
, Mark Jeanson
, et al.
·
Journal of Surface Mount Technology
Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware
2016
·
Matt Kelly
, Mark Jeanson
, et al.
·
Soldering and Reliability Conferences
Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware
2015
·
Matt Kelly
, Mark Jeanson
, et al.
·
SMTA International
Overcoming Head-In-Pillow Defects in Hybrid LGA Socket Assembly
2012
·
Marie Cole
, Theron Lewis
, et al.
·
SMTA International
Lead-Free Solder Assembly Implementation for a Mid-Range Power Systems Server
2012
·
PK Pu
, Theron Lewis
, et al.
·
Journal of Surface Mount Technology
Novel method for PTH soldering driven by the thermal restrictions of a PTH LCD device
2011
·
Cliff Chen
, Michk Huang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Lead-Free Vapor Phase Assembly Compatible Materials For A High Performance Smt Daughter Card Connector
2011
·
Matt Kelly
, Ying Yu
, et al.
·
SMTA International
Very High Lead Count SMT Backplane Connector Rework Process: Recognizing the Challenges
2011
·
Jim Bielick
, Mitchell G. Ferrill
, et al.
·
IMAPSource Proceedings
High Thermal Mass, Very High Lead Count SMT Connector Rework Process: Process and Problem Resolution
2010
·
Jim Bielick
, Brian Chapman
, et al.
·
Pan Pacific Symposium
Reliability of SMT Connectors Due to Thermal and Mechanical Fatigue
2007
·
Arv Sinha
, Joe Kuczynski
, et al.
·
SMTA International
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Works count:
15
Citation count:
6
H-index:
1
I10-index:
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