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Lead-Free Vapor Phase Assembly Compatible Materials For A High Performance Smt Daughter Card Connector

Year: 2011

Type: article

Source: SMTA International

DOI: 10.37665/smoxqks37099

Authors: Matt Kelly, Ying Yu, John Healey, Wai Ma, Emanuele Lopergolo, Jing Zhang, Jay Diepenbrock, Theron Lewis, Vijay Khanna, Ruediger Kellmann, Jim Bielick

Institution: IBM (Canada)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416876830

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