Work

Materials for Advanced Packaging

Year: 2008

Type: book

Source: Springer eBooks

DOI: 10.1007/978-0-387-78219-5

Authors: Daniel Lu, C.P. Wong

Institution: Georgia Institute of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W590555423

FWCI: 5.397

Cites:

Cited by: 307

Related to: 10

Parts: 19