Author

Daniel Lu

Observed institutions: Georgia Institute of Technology, Chinese Academy of Sciences, Henkel (United States), Shenzhen Institutes of Advanced Technology

OpenAlex ID: A5109463511

Materials for Advanced Packaging

2008 · Daniel Lu, C.P. Wong · Springer eBooks · 307

Electrical Conductive Adhesives with Nanotechnologies

2009 · Yi Li, Daniel Lu, et al. · Springer eBooks · 141

NiCo2O4 nanosheets in-situ grown on three dimensional porous Ni film current collectors as integrated electrodes for high-performance supercapacitors

2015 · Tao Wang, Ying Guo, et al. · Journal of Power Sources · 78

Tailored surface chemistry of SiO2 particles with improved rheological, thermal-mechanical and adhesive properties of epoxy based composites for underfill applications

2018 · Gang Li, Yachuan He, et al. · Polymer · 50

Clean and in-situ synthesis of copper–epoxy nanocomposite as a matrix for dielectric composites with improved dielectric performance

2014 · Gang Li, Shuhui Yu, et al. · Composites Science and Technology · 34

Effects of Surface-Modified Alkyl Chain Length of Silica Fillers on the Rheological and Thermal Mechanical Properties of Underfill

2016 · Qian Guo, Pengli Zhu, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 20

Electrically Conductive Adhesives (ECAs)

2016 · Daniel Lu, C. P. Wong · Springer eBooks · 17

Intrinsically Conducting Polymers (ICPs)

2009 · Yi Li, Daniel Lu, et al. · Springer eBooks · 14

Isotropically Conductive Adhesives (ICAs)

2009 · Yi Li, Daniel Lu, et al. · Springer eBooks · 14

Conductive Nano-Inks

2009 · Yi Li, Daniel Lu, et al. · Springer eBooks · 10

Anisotropically Conductive Adhesives/Films (ACA/ACF)

2009 · Yi Li, Daniel Lu, et al. · Springer eBooks · 9

Insights into the role of surface hydroxyl of the silica fillers in the bulk properties of resulting underfills

2015 · Gang Li, Pengli Zhu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 7

Nanotechnology

2009 · Yi Li, Daniel Lu, et al. · Springer eBooks · 4

68.3: Next Generation Liquid Optically Clear Adhesives

2013 · Daniel Lu, James Wang, et al. · SID Symposium Digest of Technical Papers · 3

Comparative study of anhydride and amine-based underfill materials for flip chip applications

2016 · Gang Li, Pengli Zhu, et al. · China Semiconductor Technology International Conference (CSTIC) · 2

Rheological and Thermomechanical Properties of Meso and Non-Porous Silica Filled Epoxy Composites

2015 · Gang Li, Peng Li Zhu, et al. · Materials science forum · 2

Non-Conductive Adhesives/Films (NCA/NCF)

2009 · Yi Li, Daniel Lu, et al. · Springer eBooks · 1

Introduction

2009 · Yi Li, Daniel Lu, et al. · Springer eBooks · 1

Future Trend of Conductive Adhesive Technology

2009 · Yi Li, Daniel Lu, et al. · Springer eBooks · 1

Fiducial Marks for Alignment in Solder Printed Flexible Printed Circuits

2020 · Daniel Lu, Zhixin Zhou

Formation of copper@silver core-shell nanoparticles with excellent antioxidation for ink-jet printing

2016 · Qionglin Ouyang, Gang Li, et al. · China Semiconductor Technology International Conference (CSTIC)

Characterizations of Electrically Conductive Adhesives

2009 · Yi Li, Daniel Lu, et al. · Springer eBooks

Works count: 26

Citation count: 720

H-index: 10

I10-index: 10