Work

Non-Conductive Adhesives/Films (NCA/NCF)

Year: 2009

Type: book-chapter

Source: Springer eBooks

Parent work: Electrical Conductive Adhesives with Nanotechnologies

DOI: 10.1007/978-0-387-88783-8_6

Authors: Yi Li, Daniel Lu, C. P. Wong

Institution: Georgia Institute of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W174254792

FWCI:

Cites: 43

Cited by: 1

Related to: 10