Year: 2026
Type: article
Abstract: In order to verify the functionality, performance, and dependability of semiconductor devices, IC testing is a crucial requirement. High consumption of energy used in carrying out tests subjects the devices to thermal stresses, affecting the reliability of the devices besides driving up the manufacturing expenses incurred by semiconductor manufacturers. This article discusses comprehensive designs with full fault detection capabilities. The article looks at six main methods: clock gating, which turns off unused parts of a circuit; partitioned testing, which divides large designs for easier analysis; test data compression, which lessens the activity of scan chains; voltage management, which improves power supply during testing; dynamic voltage and frequency scaling, which adjusts to different workload needs; and enhanced scan chain optimization, which reduces unnecessary signal changes. All these methodologies afford an answer to thermal issues, increase the lifespan of these devices, cut the cost of production, and minimize environmental degradation by using less energy. The strategies offer realistic implementation systems, which can be used on a wide range of integrated circuit structures encompassing mobile processors, automotive electronics, and high-performance computing systems. Future plans include combining machine learning to create patterns, managing power use in different designs, and setting industry-wide standards for power-aware Design for Test practices.
Author: Sheetal Kaul
Institution: Intel (United States)
Language: English
Subfield: Hardware and Architecture
Field: Computer Science
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W7147053823
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