Highly Thermally Conductive Epoxy Composite With Small‐Sized Boron Nitride/Alumina Hybrid Fillers for Fine‐Pitch Underfill Application
Year: 2026
Type: article
DOI: 10.1002/app.71735
Authors: Jiou Zhang, Jiaao Yu, Yanyan Hu, Ye Shi, Fei Xiao
Institution: Fudan University
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7225166951
