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Filip Schleicher

Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding with sub-300nm Alignment Precision
2022 · Aleksandrs Marinins, Sebastian Hansch, et al. · IEEE Journal of Selected Topics in Quantum Electronics · 65
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Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration
2020 · Anne Jourdain, Filip Schleicher, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 65
Localized states in advanced dielectrics from the vantage of spin- and symmetry-polarized tunnelling across MgO
2014 · F. Schleicher, U. Halisdemir, et al. · Nature Communications · 56
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Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network
2022 · R. Chen, M. Lofrano, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 44
Disentangling Magnetic Hardening and Molecular Spin Chain Contributions to Exchange Bias in Ferromagnet/Molecule Bilayers
2018 · Samy Boukari, Hashim Jabbar, et al. · Nano Letters · 43
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Buried Power Rail Integration With FinFETs for Ultimate CMOS Scaling
2020 · Anshul Gupta, Olalla Varela Pedreira, et al. · IEEE Transactions on Electron Devices · 42
Control of defect-mediated tunneling barrier heights in ultrathin MgO films
2010 · D. J. Kim, W. S. Choi, et al. · Applied Physics Letters · 33
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Enabling Logic with Backside Connectivity via n-TSVs and its Potential as a Scaling Booster
2021 · A. Veloso, Anne Jourdain, et al. · Symposium on VLSI Technology · 30
Linking Electronic Transport through a Spin Crossover Thin Film to the Molecular Spin State Using X-ray Absorption Spectroscopy Operando Techniques
2018 · Filip Schleicher, Michał Studniarek, et al. · ACS Applied Materials & Interfaces · 30
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28nm pitch single exposure patterning readiness by metal oxide resist on 0.33NA EUV lithography
2021 · Danilo De Simone, Luka Kljucar, et al. · Extreme Ultraviolet (EUV) Lithography · 29
Design and Optimization of SRAM Macro and Logic Using Backside Interconnects at 2nm node
2021 · R. Chen, G. Sisto, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 27
Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails
2022 · A. Veloso, A. Jourdain, et al. · IEEE Transactions on Electron Devices · 25
Spin-driven electrical power generation at room temperature
2019 · K. Katcko, E. Urbain, et al. · Communications Physics · 25
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Probing a Device's Active Atoms
2017 · Michał Studniarek, Ufuk Halisdemir, et al. · Advanced Materials · 25
Tunneling Spintronics across MgO Driven by Double Oxygen Vacancies
2017 · Beata Taudul, Elmer Nahuel Monteblanco, et al. · Advanced Electronic Materials · 23
Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias
2024 · P. Zhao, L. Witters, et al. · IEEE Transactions on Electron Devices · 21
Buried Power Rail Integration with Si FinFETs for CMOS Scaling beyond the 5 nm Node
2020 · A. Gupta, H. Mertens, et al. · Symposium on VLSI Technology · 19
Modulating the Ferromagnet/Molecule Spin Hybridization Using an Artificial Magnetoelectric
2017 · Michał Studniarek, Salia Cherifi‐Hertel, et al. · Advanced Functional Materials · 19
Encoding Information on the Excited State of a Molecular Spin Chain
2021 · Kostantine Katcko, Etienne Urbain, et al. · Advanced Functional Materials · 18
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Buried Power Rail Scaling and Metal Assessment for the 3 nm Node and Beyond
2020 · A. Gupta, O. Varela Pedreira, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 17
Consolidated picture of tunnelling spintronics across oxygen vacancy states in MgO
2019 · F Schleicher, B Taudul, et al. · Journal of Physics D Applied Physics · 14
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Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails
2022 · A. Veloso, A. Jourdain, et al. · IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 13
MgO magnetic tunnel junctions of enduring F-type upon annealing
2015 · F Schleicher, U Halisdemir, et al. · Journal of Physics D Applied Physics · 8
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Oxygen-vacancy driven tunnelling spintronics across MgO
2016 · U. Halisdemir, F. Schleicher, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7
Oxygen vacancy-driven spin-transfer torque across MgO magnetic tunnel junctions
2025 · L. M. Kandpal, B. Taudul, et al. · npj Spintronics · 6
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Works count: 49
Citation count: 771
H-index: 18
I10-index: 22
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