Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
James Verzosa
OpenAlex ID:
A5000483077
Edge Protection of Temporarily Bonded Wafers during Backgrinding
2009
·
Dongshun Bai
, Xing-Fu Zhong
, et al.
·
ECS Transactions
·
17
PDF
Show more works
View as search
Works count:
1
Citation count:
17
H-index:
1
I10-index:
1
Year
Topic
Type
