Year: 2009
Type: conference-paper
Abstract: Edge chipping during backgrinding is one of the main challenges of processing temporarily bonded wafers. The edge chipping may propagate during subsequent process steps and eventually result in yield loss. We conducted a study to compare different methodologies for wafer edge protection during backgrinding, including using pre-thinned carrier wafers, large carrier wafers, edge-trimmed device wafers, and material edge modification. This paper will introduce the metrology developed to quantify edge chipping and compare the results from different protection methods.
Source: ECS Transactions
DOI: 10.1149/1.3096533
Institutions: Brewer Science (United States), EV Group (Austria)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W2321131091