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Daniel Burgstaller
Observed name:
D. Burgstaller
Institution:
EV Group (Austria)
Observed institution:
EV Group (Austria)
OpenAlex ID:
A5086254697
Recent progress in thin wafer processing
2013
·
Thomas Uhrmann
, Thorsten Matthias
, et al.
·
IEEE International D Systems Integration Conference
·
19
Edge Protection of Temporarily Bonded Wafers during Backgrinding
2009
·
Dongshun Bai
, Xing-Fu Zhong
, et al.
·
ECS Transactions
·
17
PDF
Novel IR Laser Cleaving for ultra-thin Layer Transfer and 3D Stacked Devices
2023
·
Thomas Uhrmann
, Peter Urban
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
12
Laser Debonding Enabling Ultra-Thin Fan-Out WLP Devices
2018
·
Thomas Uhrmann
, Matthias Pichler
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
6
Room temperature debonding — An enabling technology for TSV and 3D integration
2012
·
Thorsten Matthias
, Gunter Pauzenberger
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
6
Thin wafer processing - yield enhancement through integrated metrology
2011
·
Thorsten Matthias
, Daniel Burgstaller
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
5
Cu-Cu Thermo-Compression Bonding for TSV Integration
2010
·
Bioh Kim
, Thorsten Matthias
, et al.
·
ECS Transactions
·
3
PDF
Room Temperature Debonding - An Enabling Technology for TSV and 3D Integration
2012
·
Thorsten Matthias
, Eric Pabo
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
·
2
Room temperature debonding — An enabling technology for TSV and 3D integration
2012
·
T. Matthias
, F. Huysmans
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Temporary-bonding and LowTemp® debonding technology for various applications
2012
·
Masaya Kawano
, Takumi Komatsu
, et al.
·
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
·
1
Low temperature packaging of BioMEMS and Lab-on-chip devices
2011
·
Thorsten Matthias
, Ron Miller
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
ZoneBOND®: Recent Developments in Temporary Bonding and Room‐Temperature Debonding
2014
·
Thorsten Matthias
, Jürgen Burggraf
, et al.
·
Wiley eBooks
Room Temperature Debonding – An Enabling Technology for TSV and 3D Integration
2012
·
Garrett Oakes
, Thorsten Matthias
, et al.
·
Wafer-Level Packaging Symposium
Equipment and Process Solutions for Low Cost High Volume Manufacturing Of 3D Integrated Devices
2012
·
Markus Wimplinger
, Jürgen Burggraf
, et al.
·
Pan Pacific Symposium
Thin Wafer Processing And Chip Stacking For 3D Integration
2011
·
Thorsten Matthias
, Daniel Burgstaller
, et al.
·
Pan Pacific Symposium
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Works count:
15
Citation count:
73
H-index:
5
I10-index:
3
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