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Phillip R. Coffman

Observed names: P. COFFMAN, P. R. Coffman, P.R. Coffman
OpenAlex ID: A5000702811
High Density, Vertical Interconnects for 3-D Integration of Silicon Integrated Circuits
2006 · C.A. Bower, D. Malta, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 48
Structure evolution in the PbO-ZrO2-TiO2 sol-gel system: Part II?Pyrolysis of acid and base-catalyzed bulk and thin film gels
1996 · P. R. Coffman, C. K. Barlingay, et al. · Journal of Sol-Gel Science and Technology · 43
Structure evolution in the PbO-ZrO2-TiO2 sol-gel system: Part I ? Characterization of prehydrolyzed precursors
1994 · P. R. Coffman, S. K. Dey · Journal of Sol-Gel Science and Technology · 40
High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors
2006 · D. Temple, C. A. Bower, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 27
Bonding for 3-D Integration of Heterogeneous Technologies and Materials
2008 · Dorota Temple, Dean Malta, et al. · ECS Transactions · 15
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Advances in 3D integration of heterogeneous materials and technologies
2007 · D. Temple, J. M. Lannon, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4
Finding the face-centered cube in the cubic closest packed structure
1992 · James P. Birk, Phillip R. Coffman · Journal of Chemical Education · 4
Chemical Synthesis of Aluminum Nitride Powders
1990 · Phillip R. Coffman, William T. Petuskey, et al. · MRS Proceedings · 4
3-D Integration Technology for High Performance Detector Arrays
2006 · Dorota Temple, Christopher A. Bower, et al. · MRS Proceedings · 2
ChemInform Abstract: Bonding Trends in (NSF)3 at High‐Pressures.
1998 · A. V. G. CHIZMESHYA, P. COFFMAN, et al. · ChemInform · 1
Works count: 10
Citation count: 188
H-index: 5
I10-index: 5
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