High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors
Year: 2006
Type: conference-paper
Authors: D. Temple, C. A. Bower, D. Malta, J. E. Robinson, P. R. Coffman, M. R. Skokan, T. B. Welch
Institution: RTI International
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2006050501