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Karthikeyan Dhandapani

Observed names: D. Karthikeyan, Dhandapani Karthikeyan, Karthikeyan D, Karthikeyan D.
ORCID: 0000-0003-1866-0405
Observed ORCID: 0000-0003-1866-0405
OpenAlex ID: A5000739142
Cu Pillar and μ-bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps
2011 · Ahmer Syed, Karthikeyan Dhandapani, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 36
Generalized Cascaded Symmetric and Level Doubling Multilevel Converter Topology with Reduced THD for Photovoltaic Applications
2019 · Karthikeyan D, Vijayakumar K, et al. · Electronics · 21
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A Multilevel Inverter Topology Using Diode Half-Bridge Circuit with Reduced Power Component
2021 · Jagabar Sathik, Shady H. E. Abdel Aleem, et al. · Energies · 19
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Investigation of the Factors Affecting the Warpage Prediction of Multi-Chip Package
2021 · Pavan Rajmane, Karthikeyan Dhandapani, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 15
Electromigration reliability and current carrying capacity of various WLCSP interconnect structures
2013 · Ahmer Syed, Karthikeyan Dhandapani, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 14
Modelling and Analysis of Voltage Mode Controlled Luo Converter
2015 · Divya Navamani Jayachandran, Vijayakumar Krishnaswamy, et al. · American Journal of Applied Sciences · 12
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Reliability Assessment and Fault Prediction in a 13-Level Multilevel Inverter Through Machine Learning with SVM
2024 · V. P. Arumbu, D. Karthikeyan · Journal of Electrical Engineering and Technology · 10
Grey wolf optimization-recurrent neural network based maximum power point tracking for photovoltaic application
2022 · Arumbu Venkadasamy Prathaban, Dhandapani Karthikeyan · Indonesian Journal of Electrical Engineering and Computer Science · 9
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Compact Thirteen-Level Inverter for PV Applications
2022 · Arumbu Venkadasamy Prathaban, Karthikeyan Dhandapani, et al. · Energies · 9
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Mitigation of current harmonics in multi-drive system
2022 · Thamizh Thentral, Ramya Rathakrishnan, et al. · International Journal of Power Electronics and Drive Systems/International Journal of Electrical and Computer Engineering · 7
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Soil pH periodic assortment with smart irrigation using aerial triboelectric nanogenerator
2023 · Dhandapani Karthikeyan, Deeba Kannan, et al. · Indonesian Journal of Electrical Engineering and Computer Science · 5
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Improving Solder Joint Reliability for PoP Packages in Current Mobile Ecosystem
2018 · Karthikeyan Dhandapani, Jiantao Zheng, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
A Comparison of Flip Chip Bump Electromigration Reliability for Cu Pillar, High Pb, SnAg, and SnPb Bump Structures
2010 · Ahmer Syed, Karthikeyan Dhandapani, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 3
A Systematic Approach to the Reliability Characterization of System in Package (SiP)
2018 · Karthikeyan Dhandapani, Brian Roggeman, et al. · IMAPSource Proceedings · 2
Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology
2017 · Wei Zhao, Mark Nakamoto, et al. · IMAPSource Proceedings · 2
Modelling and simulation of z source inverter based grid connected PV system
2014 · R. Palanisamy, A. U. Mutawakkil, et al. · IEEE International Conference on Computational Intelligence and Computing Research (ICCIC) · 2
A Methodology for Chip - Package Interaction (CPI) Modeling in 3D IC Structures
2012 · Karthikeyan Dhandapani, Ahmer Syed, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2
Improving farming by quickly detecting muskmelon plant diseases using advanced ensemble learning and capsule networks
2025 · Deeba Kannan, Nagamuthu Krishnan Sundarasrinivasa Sankaranarayanan, et al. · Indonesian Journal of Electrical Engineering and Computer Science · 1
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Integrated PV-Based Boost-Cuk Converter For EV Charging Station Applications
2023 · Sathish R, Sekar V, et al. · International Conference on Intelligent Technologies for Sustainable Electric and Communications Systems (iTech SECOM) · 1
Early fire detection technique for human being using deep learning algorithm
2023 · Kannan Deeba, Sattianadan Dasarathan, et al. · Indonesian Journal of Electrical Engineering and Computer Science · 1
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PI controller for photovoltaic-fed novel multilevel inverter topologies
2022 · Dhandapani Karthikeyan, Simran Rajiv Khiani, et al. · Indonesian Journal of Electrical Engineering and Computer Science · 1
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Design of vehicle using Ackermann steering with IoT concept
2021 · Albert Paul Arunkumar, Palanisamy R., et al. · Indonesian Journal of Electrical Engineering and Computer Science · 1
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A Process Dependent Warpage and Stress Model for 3D Packages Considering Incoming Die/Substrate Warpage and Assembly Process Impacts
2013 · Wei Lin, Ahmer Syed, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
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Warpage Prediction Improvements for Thin Package-on-Package Architectures
2024 · Nakul Kothari, Karthikeyan Dhandapani, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Hybrid rater to quantify and measure the severity of infection and spread of infection in muskmelon
2024 · Deeba Kannan, Amutha Balakrishnan, et al. · Bulletin of Electrical Engineering and Informatics
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Works count: 29
Citation count: 179
H-index: 9
I10-index: 7
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