Work

Cu Pillar and μ-bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps

Year: 2011

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2011.5898534

Authors: Ahmer Syed, Karthikeyan Dhandapani, Robert Moody, Lou Nicholls, Mike Kelly

Institution: Amkor Technology (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2148338689

FWCI: 5.942

Cites: 13

Cited by: 36

Related to: 10