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Roger Massey

Observed names: R Massey, R T Massey, R. Massey, R. T. Massey
OpenAlex ID: A5004439655
Impact of surface treatment on high frequency signal loss characteristics
2009 · A. Zee, R. Massey, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 9
Nickel dependence of hydrogen co-deposition and nanoporosity in electrolessly deposited Cu-films
2020 · Tobias Bernhard, Edith Steinhauser, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Use of non-etching adhesion promoters in advanced PCB applications
2010 · A. Zee, R. Massey · Electronic System-Integration Technology Conference (ESTC) · 6
Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures
2021 · T. Bernhard, S. Dieter, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
Advantage of non-etching adhesion promoter on high frequency signal loss
2010 · A. Zee, R. Massey · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 5
Design and Fabrication of Super-High Strength Glass-Ceramic to Metal Seals
2008 · D. P. Kramer, R. T. Massey · Ceramic engineering and science proceedings · 4
The Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu Films
2021 · Tobias Bernhard, Sebastian Zarwell, et al. · Journal of Microelectronics and Electronic Packaging · 3
A Predictive Metallographic Means to Identify The Relative Risk of Failure for Plated Micro Vias
2023 · Tobias Bernhard, Roger Massey, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Plating and Recrystallization of Galvanic Cu Films on Roll Annealed and Polycrystalline Cu Foils and the Effect of Intermediate Electroless Cu Layers
2022 · T. Bernhard, R. Massey, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Hydrogen Embrittlement and Nano Void Classification within Electroless Copper Deposits
2020 · T. Bernhard, E. Steinhauser, et al. · International Wafer Level Packaging Conference (IWLPC) · 2
Investigation of a Proactive Glass Filler Removal in IC Substrate Build Up Films and its Effect on Topography and Copper Adhesion Reliability
2019 · Stefan Kempa, Wolfgang Friz, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2
Electrolytic solder deposit for next generation flip chip solder bumping: 2010 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference
2010 · Stephen Kenny, Bernd Roelfs, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 2
Untitled
2010 · Roger Massey, Koichiro Terauchi · Journal of The Japan Institute of Electronics Packaging · 2
PDF
Temporary Non-Etching Adhesion Promotion System for Dry Film Applications
2008 · J. Huang, R Massey, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 2
Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation Substrates
2019 · Christian Wendeln, Edith Steinhäuser, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
Injection molding-sealing of glass to low melting metals
1985 · D P Kramer, R T Massey, et al. · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 1
PDF
In-situ vacuum-assisted molding of glass-metal electrical components
1985 · D P Kramer, R T Massey · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 1
PDF
Vacuum-injection molding of glass-metal electrical components
1983 · Daniel P. Kramer, Roger Massey · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 1
A Viable Copper Based Alternative to Palladium Activation Systems for Electroless Copper Processing
2024 · Roger Massey, Andre Beyer, et al. · IMAPSource Proceedings
PDF
Copper Crystal Structures in Plated Microvias. Their Recrystallisation and a Means to Identify Joints at Risk of Premature Failure
2021 · T. Bernhard, R. Massey, et al. · International Symposium on Microelectronics
PDF
Hydrogen Embrittlement and Nano Void Classification Within Electroless Copper Deposits
2020 · T. Bernhard, E. Steinhäuser, et al. · Wafer-Level Packaging Symposium
Use of Non Etching Adhesion Promoters in Advanced PCB Applications
2010 · Roger Massey, Adrian Zee · SMTA International
Impact of Surface Treatment on High Frequency Signal Loss Characteristics » Full Papers
2009 · A. Zee, Roger Massey, et al.
Permanent Non-Etching Adhesion Promotion System for Solder Mask Applications
2008 · S. Kumashiro, R Massey, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Glass-ceramic hermetic seals to high thermal expansion metals
1987 · Daniel P. Kramer, Roger Massey · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)
Works count: 26
Citation count: 56
H-index: 5
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