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Electrolytic solder deposit for next generation flip chip solder bumping: 2010 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference

Year: 2010

Type: conference-paper

Source: International Microsystems, Packaging, Assembly and Circuits Technology Conference

DOI: 10.1109/impact.2010.5699485

Authors: Stephen Kenny, Bernd Roelfs, Kai Matejat, Tafadzwa Magaya, Roger Massey

Institution: Atotech (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2015360577

FWCI:

Cites:

Cited by: 2

Related to: 10