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Daeyoung Kong

Machine Tool Design and Operation Strategies for Green Manufacturing
2010 · Nancy Diaz, Seungchoun Choi, et al. · eScholarship (California Digital Library) · 110
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Software-based tool path evaluation for environmental sustainability
2011 · Daeyoung Kong, Seungchoun Choi, et al. · Journal of Manufacturing Systems · 103
An additively manufactured manifold-microchannel heat sink for high-heat flux cooling
2023 · Daeyoung Kong, Euibeen Jung, et al. · International Journal of Mechanical Sciences · 76
A holistic approach to thermal-hydraulic design of 3D manifold microchannel heat sinks for energy-efficient cooling
2021 · Daeyoung Kong, Yunseo Kim, et al. · Case Studies in Thermal Engineering · 66
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Hierarchically Structured Laser-Induced Graphene for Enhanced Boiling on Flexible Substrates
2020 · Daeyoung Kong, Minsoo Kang, et al. · ACS Applied Materials & Interfaces · 55
Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits
2021 · Daewoong Jung, Haeun Lee, et al. · International Journal of Heat and Mass Transfer · 54
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Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa
2019 · Daeyoung Kong, Ki Wook Jung, et al. · International Journal of Heat and Mass Transfer · 53
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Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels
2024 · Daeyoung Kong, Heungdong Kwon, et al. · Energy Conversion and Management · 52
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Thermal performance analysis of heat pipe heat exchanger for effective waste heat recovery
2024 · Gyohoon Geum, Sukkyung Kang, et al. · International Communications in Heat and Mass Transfer · 46
Capillary-enhanced two-phase micro-cooler using copper-inverse-opal wick with silicon microchannel manifold for high-heat-flux cooling application
2024 · Heungdong Kwon, Qianying Wu, et al. · International Communications in Heat and Mass Transfer · 45
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Multimodal machine learning for predicting heat transfer characteristics in micro-pin fin heat sinks
2024 · Haeun Lee, Geonhee Lee, et al. · Case Studies in Thermal Engineering · 27
Enhanced Heat Transfer Using Microporous Copper Inverse Opals
2018 · Hyoungsoon Lee, Tanmoy Maitra, et al. · Journal of Electronic Packaging · 25
Enhanced immersion cooling using laser-induced graphene for Li-ion battery thermal management
2024 · EuiBeen Jung, Daeyoung Kong, et al. · International Communications in Heat and Mass Transfer · 24
Analysis of the enhancing mechanism in pool boiling heat transfer through wetting speed for rough aluminum surfaces with FC-72
2020 · Jun Kim, Jeongwoo Yeom, et al. · International Journal of Heat and Mass Transfer · 24
Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
2018 · Chirag R. Kharangate, Ki Wook Jung, et al. · Journal of Electronic Packaging · 23
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Thermal design framework of heat pipe heat exchanger for efficient waste heat recovery
2025 · Seungjae Lee, Sukkyung Kang, et al. · Energy · 22
Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap
2024 · Kiwan Kim, Daeyoung Kong, et al. · Applied Thermal Engineering · 17
Dynamic artificial neural network model for ultralow temperature prediction in hydrogen storage tank
2023 · Haeun Lee, Kiwan Kim, et al. · Journal of Energy Storage · 17
Micro‐/Nanohierarchical Surfaces for Enhanced Pool Boiling in Large‐Area Silicon Multichips
2025 · Youngseob Lee, Kiwan Kim, et al. · Small Structures · 15
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Boiling-induced thermal degradation of copper inverse opals and its mitigation
2024 · Daeyoung Kong, Kiwan Kim, et al. · International Communications in Heat and Mass Transfer · 15
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Experimental and computational investigation of thermal performance and fluid flow in two-phase closed thermosyphon
2023 · Sehyeon Cho, Daeyoung Kong, et al. · Applied Thermal Engineering · 15
Development of a Capillary-Driven Two-Phase Microcooler Using Copper Wiremesh 3d Manifold and Silicon Micropin Fins Wicks
2025 · Daeyoung Kong, Roman Giglio, et al. · International Journal of Mechanical Sciences · 14
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Thermal-Hydraulic characterization in Manifold-microchannel heat sinks for Energy-efficient cooling of HEV/EV power modules
2025 · Yunseo Kim, Daeyoung Kong, et al. · Applied Thermal Engineering · 12
Enhanced heat transfer in a microchannel with pseudo-roughness induced by Onsager-Wien effect
2023 · R. Deepak Selvakumar, Daeyoung Kong, et al. · Applied Thermal Engineering · 5
Software Support for Environmentally Benign Mold Making Process and Operations
2013 · Daeyoung Kong, Seungchoun Choi, et al. · Springer eBooks · 5
Works count: 44
Citation count: 942
H-index: 17
I10-index: 23
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