Work

Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap

Year: 2024

Type: article

Source: Applied Thermal Engineering

DOI: 10.1016/j.applthermaleng.2023.122325

Authors: Kiwan Kim, Daeyoung Kong, Yunseo Kim, Bongho Jang, Jungwan Cho, Hyuk-Jun Kwon, Hyoungsoon Lee

Institutions: Chung-Ang University, Stanford University, Daegu Gyeongbuk Institute of Science and Technology, Sungkyunkwan University

Language: English

Topic: Heat Transfer and Boiling Studies

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4390789963

FWCI: 2.164

Cites: 37

Cited by: 17

Related to: 10