Author

Peter Zimprich

Observed names: P Zimprich, P. Zimprich

Institution: University of Vienna

Observed institution: University of Vienna

OpenAlex ID: A5007203546

Characterization of mechanical and thermal properties of thin Cu foils and wires

2002 · B. Weiss, V. Gröger, et al. · Sensors and Actuators A Physical · 90

Size effects in small scaled lead-free solder joints

2007 · P. Zimprich, A. Betzwar-Kotas, et al. · Journal of Materials Science Materials in Electronics · 56

Mechanical Size Effects in Miniaturized Lead-Free Solder Joints

2007 · Peter Zimprich, Usman Saeed, et al. · Journal of Electronic Materials · 51

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Non-contacting strain measurements of ceramic and carbon single fibres by using the laser-speckle method

2003 · C. Reder, D. Loidl, et al. · Composites Part A Applied Science and Manufacturing · 26

Constraining Effects of Lead-Free Solder Joints During Stress Relaxation

2008 · Peter Zimprich, Usman Saeed, et al. · Journal of Electronic Materials · 19

The Austrian Radon Project

1996 · H. Friedmann, P. Zimprich, et al. · Environment International · 10

Temperature Dependent Elastic and Thermal Properties of Thin Copper Foils

2006 · G. Khatibi, P. Zimprich, et al. · Wiley eBooks · 3

Anwendung eines Laser-Speckle-Korrelationsverfahrens zur Messung lokaler Dehnungen in Mikromaterialien (Application of a Laser-Speckle Correlation Technique for Measuring Local Strain in Micromaterials)

2006 · Sebastian C. Schneider, Bernhard Zagar, et al. · tm - Technisches Messen · 3

Size Effects in Lead Free Solder-Joints

2008 · A. Betzwar-Kotas, G. Khatibi, et al. · Springer eBooks · 1

A new method to characterize the thermomechanical response of multilayered structures in power electronics

2006 · P. Zimprich, T. Licht, et al. · Microelectronics Reliability · 1

Thermo‐Mechanical Properties of Electrodeposited Ultra Fine Grained Cu‐Foils for Printed Wiring Boards

2004 · A. Betzwar‐Kotas, V. Gröger, et al. · Wiley eBooks · 1

OS6(6)-24(OS06W0434) Mechanical and Thermal Properties of Thin Metallic Foils and Wires Using Laser Techniques

2003 · Brigitte Weiss, Peter Zimprich, et al. · The Abstracts of ATEM International Conference on Advanced Technology in Experimental Mechanics Asian Conference on Experimental Mechanics · 1

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OS06W0434 Mechanical and thermal properties of thin metallic foils and wires using laser techniques

2003 · B. Weiss, P. Zimprich, et al. · The Abstracts of ATEM International Conference on Advanced Technology in Experimental Mechanics Asian Conference on Experimental Mechanics · 1

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Hochauflösende Laser-Speckle-Methode zur Charakterisierung komplexer thermomechanischer Eigenschaften von Vielschicht-Systemen (Application of a High-Resolution Laser-Speckle Strain Gauge for the Characterization of Thermomechanical Properties of Multilayer Systems)

2008 · Roland Kothbauer, Stefan J. Ruptisch, et al. · tm - Technisches Messen

Advanced laser speckle techniques characterize the complex thermomechanical properties of thin multilayered structures

2007 · P Zimprich, B G Zagar · Estonian Journal of Engineering

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Exploring the world of micromaterials using laser-speckle techniques

2006 · Bernhard G. Zagar, Peter Zimprich, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Specific defects and thermomechanical properties of electrodeposited Cu foils

2005 · V. Gröger, G. Khatabi, et al. · Archives of Metallurgy and Materials

Investigations of the green- and infrared-stimulated luminescence using the recuperation effect

2000 · P. Zimprich, P. Hille · Radiation Measurements