Work

A new method to characterize the thermomechanical response of multilayered structures in power electronics

Year: 2006

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2006.07.067

Authors: P. Zimprich, T. Licht, B. Weiss

Institutions: University of Vienna, Infineon Technologies (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Foundation

OpenAlex ID: W2004110042

FWCI: 0.328

Cites: 8

Cited by: 1

Related to: 10