Author

Karen H. R. Kirmse

Observed names: K. H. R. Kirmse, K. Kirmse, K.H. Kirmse, K.H.R. Kirmse, Karen Kirmse

Institution: Texas Instruments (United States)

Observed institutions: University of Wisconsin–Madison, Texas Instruments (United States)

OpenAlex ID: A5016587564

Study of C4F8/N2 and C4F8/Ar/N2 plasmas for highly selective organosilicate glass etching over Si3N4 and SiC

2003 · Xuefeng Hua, X. Wang, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 55

SiO2 to Si selectivity mechanisms in high density fluorocarbon plasma etching

1996 · K. H. R. Kirmse, A. E. Wendt, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 36

Mechanisms for polycrystalline silicon defect passivation by hydrogenation in an electron cyclotron resonance plasma

1995 · E. S. Cielaszyk, K. H. R. Kirmse, et al. · Applied Physics Letters · 26

A 65 nm CMOS technology for mobile and digital signal processing applications

2005 · A. Chattedee, J. Yoon, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 21

Experiments with back side gas cooling using an electrostatic wafer holder in an electron cyclotron resonance etching tool

1994 · J. A. Meyer, K. H. R. Kirmse, et al. · Applied Physics Letters · 17

Mask undercut in deep silicon etch

2011 · I. Saraf, M. Goeckner, et al. · Applied Physics Letters · 15

Fluorocarbon high density plasmas. VIII. Study of the ion flux composition at the substrate in electron cyclotron resonance etching processes using fluorocarbon gases

1994 · Karen H. R. Kirmse, Amy E. Wendt, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 14

Ion bombardment energy control for selective fluorocarbon plasma etching of organosilicate glass

2004 · R. Silapunt, A. E. Wendt, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 12

Spectral scatterometry for 2D trench metrology of low-K dual-damascene interconnect

2002 · Vladimir A. Ukraintsev, Mak Kulkarni, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 12

Kinetics of the deposition step in time multiplexed deep silicon etches

2012 · Iqbal R. Saraf, Matthew J. Goeckner, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 11

Ion energy control at substrates during plasma etching of patterned structures

2007 · R. Silapunt, A. E. Wendt, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 11

Study of C4F8/CO and C4F8/Ar/CO plasmas for highly selective etching of organosilicate glass over Si3N4 and SiC

2004 · Li Ling, X. Hua, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 11

Miniaturized reverse modulation loop of a CQPSK 120 Mbit/s modem for spacecraft applications

1992 · K.H.R. Kirmse, R.K. Gupta, et al. · IEEE Transactions on Microwave Theory and Techniques · 4

Local CD variation in 65nm node with PSM processes STI topography characterization (I)

2006 · Yiming Gu, Simon Chang, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

A designer friendly 45nm high performance technology with in-situ C-doped e-SiGe & dual stress liner in SRAM

2008 · R. Khamankar, C. Bowen, et al. · Symposium on VLSI Technology

Fluorocarbon-based plasma etching: the role of the energy distribution of bombarding ions

2003 · Rardchawadee Silapunt, Shuntel Williams, et al. · APS

Several consequences of Ding's etch rate expression: ion beam etching, etch rate control and selectivity

2002 · N. Hershkowitz, R.A. Breun, et al. · IEEE International Conference on Plasma Science (ICOPS)

Study of Silicon Dioxide to Silicon Etching Selectivity in High Density, Low Pressure Fluorocarbon Plasmas

1996 · K. H. R. Kirmse

Composition of ion flux and etch rates for Si and SiO/sub 2/ in high density fluorocarbon plasmas

1995 · K.H.R. Kirmse, A.E. Wendt, et al. · IEEE International Conference on Plasma Science (ICOPS)

Works count: 19

Citation count: 248

H-index: 11

I10-index: 12