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Manoj Kumar Majumder

Semiconductor Physics and Devices
2020 · Manoj Kumar Majumder, Vijay Rao Kumbhare, et al. · CRC Press eBooks · 334
Analysis of Delay and Dynamic Crosstalk in Bundled Carbon Nanotube Interconnects
2014 · Manoj Kumar Majumder, B. K. Kaushik, et al. · IEEE Transactions on Electromagnetic Compatibility · 97
Carbon Nanotube: Properties and Applications
2014 · Brajesh Kumar Kaushik, Manoj Kumar Majumder · SpringerBriefs in applied sciences and technology · 96
Time and Frequency Domain Analysis of MLGNR Interconnects
2015 · Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, et al. · IEEE Transactions on Nanotechnology · 80
Carbon Nanotube Based VLSI Interconnects
2014 · Brajesh Kumar Kaushik, Manoj Kumar Majumder · SpringerBriefs in applied sciences and technology · 72
Frequency response and bandwidth analysis of multi‐layer graphene nanoribbon and multi‐walled carbon nanotube interconnects
2014 · Manoj Kumar Majumder, Narasimha Reddy Kukkam, et al. · Micro & Nano Letters · 66
Analysis of MWCNT and Bundled SWCNT Interconnects: Impact on Crosstalk and Area
2012 · Manoj Kumar Majumder, Nisarg D. Pandya, et al. · IEEE Electron Device Letters · 65
Graphene Based On-Chip Interconnects and TSVs : Prospects and Challenges
2014 · Vobulapuram Ramesh Kumar, Brajesh Kumar Kaushik, et al. · IEEE Nanotechnology Magazine · 50
Stability and delay analysis of multi-layered GNR and multi-walled CNT interconnects
2015 · Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, et al. · Journal of Computational Electronics · 48
Carbon Nanotube Based 3-D Interconnects - A Reality or a Distant Dream
2014 · Brajesh Kumar Kaushik, Manoj Kumar Majumder, et al. · IEEE Circuits and Systems Magazine · 48
Analytical Study of Bundled MWCNT and Edged MLGNR Interconnects: Impact on Propagation Delay and Area
2019 · Vijay Rao Kumbhare, Punya Prasanna Paltani, et al. · IEEE Transactions on Nanotechnology · 47
High-Speed Interconnects: History, Evolution, and the Road Ahead
2022 · Vijay Rao Kumbhare, Rahul Kumar, et al. · IEEE Microwave Magazine · 46
Delay and crosstalk reliability issues in mixed MWCNT bundle interconnects
2014 · Manoj Kumar Majumder, Pankaj Kumar Das, et al. · Microelectronics Reliability · 46
Dynamic crosstalk effect in mixed CNT bundle interconnects
2012 · M.K. Majumder, N.D. Pandya, et al. · Electronics Letters · 43
Hardware Security Exploiting Post-CMOS Devices: Fundamental Device Characteristics, State-of-the-Art Countermeasures, Challenges and Roadmap
2021 · Aditya Japa, Manoj Kumar Majumder, et al. · IEEE Circuits and Systems Magazine · 39
Crosstalk Induced Delay Analysis of Randomly Distributed Mixed CNT Bundle Interconnect
2015 · Manoj Kumar Majumder, Pankaj Kumar Das, et al. · Journal of Circuits Systems and Computers · 30
Process-Induced Delay Variation in SWCNT, MWCNT, and Mixed CNT Interconnects
2015 · Manoj Kumar Majumder, Jainender Kumar, et al. · IETE Journal of Research · 28
Performance analysis of single- and multi-walled carbon nanotube based through silicon vias
2015 · Arsalan Alam, Manoj Kumar Majumder, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 27
Delay uncertainty in MLGNR interconnects under process induced variations of width, doping, dielectric thickness and mean free path
2014 · K. Narasimha Reddy, Manoj Kumar Majumder, et al. · Journal of Computational Electronics · 26
Through Silicon Vias
2016 · Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, et al. · CRC Press eBooks · 25
Performance analysis of Cu/CNT-based TSV: impact on crosstalk and power
2022 · Shivangi Chandrakar, Deepika Gupta, et al. · Journal of Computational Electronics · 19
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Role of Through Silicon Via in 3D Integration: Impact on Delay and Power
2020 · Shivangi Chandrakar, Deepika Gupta, et al. · Journal of Circuits Systems and Computers · 19
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power
2022 · Maya Chandrakar, Manoj Kumar Majumder · IEEE Transactions on Components Packaging and Manufacturing Technology · 18
Impact of Interconnect Spacing on Crosstalk for Multi-layered Graphene Nanoribbon
2019 · Vijay Rao Kumbhare, Punya Prasanna Paltani, et al. · IETE Journal of Research · 18
Reliability Concerns of TSV-Based 3-D Integration: Impact of Interfacial Crack
2023 · Vandana Kumari, Shivangi Chandrakar, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 16
Works count: 140
Citation count: 1,879
H-index: 20
I10-index: 43
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