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Ronit Das
Observed name:
R. Das
Institution:
Binghamton University
Observed institution:
Binghamton University
ORCID:
0000-0003-3366-5773
Observed ORCID:
0000-0003-3366-5773
OpenAlex ID:
A5031590169
Understanding and preventing Cu–Sn micro joint defects through design and process control
2021
·
M. Njuki
, S. Thekkut
, et al.
·
Journal of Applied Electrochemistry
·
17
Preventing Void Growth Between Ni3Sn4 and Solder
2022
·
M. Njuki
, S. Thekkut
, et al.
·
Journal of Electronic Materials
·
14
Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures
2021
·
Manu Yadav
, Thaer Alghoul
, et al.
·
Journal of Electronic Packaging
·
14
All-electrochemical synthesis of SnBi/SnAgCu structures for low-temperature formation of high-reliability solder microjoints
2024
·
Michael Njuki
, Abdullah Faisal Pasha
, et al.
·
Journal of Alloys and Compounds
·
12
Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Under Temperature Cycling With a Modified Garofalo Creep Model Based on Bi Concentration
2024
·
Souvik Chakraborty
, Yaxiong Chen
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
10
Post-annealing of hybrid SAC305-SnBi solder joints formed with a 150 °C reflow to improve fatigue resistance
2025
·
Ronit Das
, Atif Mahmood
, et al.
·
Journal of Materials Science Materials in Electronics
·
9
Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints
2020
·
S. Thekkut
, R. Das
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
Superior reliability of SAC305-SnBi solder joints formed in a 150 °C reflow
2025
·
Ronit Das
, Atif Mahmood
, et al.
·
Materials Science and Engineering A
·
4
Early transient creep of single crystal SnAgCu solder joints
2022
·
Ronit Das
, Sanoop Thekkut
, et al.
·
Journal of Materials Science Materials in Electronics
·
4
Deformation and damage properties of low temperature SnAgCu-Bi-Sb solder joints
2026
·
Ronit Das
, Atif Mahmood
, et al.
·
International Journal of Mechanical Sciences
·
1
Constitutive relations, effects of aging, and Sb addition on SnAgCu-xBi (x = 0-45 wt.%) solder joints
2026
·
Ronit Das
, Atif Mahmood
, et al.
·
SSRN Electronic Journal
Comparing/Optimizing Actual Solder Fatigue Life
2023
·
Ronit Das
, Atif Mahmood
, et al.
·
Pan Pacific Symposium
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Works count:
12
Citation count:
90
H-index:
6
I10-index:
5
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