Work

Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Under Temperature Cycling With a Modified Garofalo Creep Model Based on Bi Concentration

Year: 2024

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51529.2024.00085

Authors: Souvik Chakraborty, Yaxiong Chen, Gaurav Sharma, Abdullah Fahim, Torsten Hauck, Ronit Das, Atif Mahmood, Jeffrey C. Suhling, Peter Borgesen

Institutions: Auburn University, NXP (United States), NXP (Germany), Binghamton University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Auburn University, NXP Semiconductors, Binghamton University

OpenAlex ID: W4400034097

FWCI: 6.807

Cites: 29

Cited by: 10

Related to: 10