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Lang Klaus-Dieter

Fan-Out Wafer Level Packaging - A Platform for Advanced Sensor Packaging
2019 · Tanja Braun, Karl-Friedrich Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 23
On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes
2016 · Brian Curran, Gerhard Fotheringham, et al. · IEEE Transactions on Microwave Theory and Techniques · 13
Packages for Fast Switching HV GaN Power Devices
2014 · Kirill Klein, Eckart Hoene, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 10
Dielectric material characterization of high frequency printed circuit board laminates and an analysis of their transmission line high frequency losses
2016 · Brian Curran, Christian Tschoban, et al. · European Microwave Conference (EuMC) · 7
Multi-layer Electro-Optical Circuit Board Fabrication on Large Panel
2016 · Henning Schroder, Marcel Neitz, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Interface Investigations and Modeling of Heavy Wire Bonds on Power Semiconductors for End of Life Determination
2008 · Klaus-Dieter Lang, J. Goehre, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 7
Power module design for utilizing of WBG switching performance
2019 · Kirill Klein, Eckart Hoene, et al. · International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe) · 5
Dielectric material characterization of high frequency printed circuit board laminates and an analysis of their transmission line high frequency losses
2016 · Brian Curran, Christian Tschoban, et al. · European Microwave Integrated Circuits Conference · 4
Integrated lithium micro batteries for highly miniaturized sensors
2014 · Robert Hahn, Katrin Hoeppner, et al. · 3
Wafer Level Embedding Technology for Packaging of Planar GaN Half-Bridge Module in High Power Density Conversion Applications.
2018 · Charles-Alix Manier, Kirill Klein, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 2
3D Integration: Status, Challenges and Requirements
2015 · M. Juergen Wolf, Klaus-Dieter Lang · Pan Pacific Symposium · 1
Modeling, fabrication and measurement of TSVs for advanced integration of RF/high-speed components
2013 · Klaus-Dieter Lang, Ivan Ndip, et al. · IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) · 1
Electromagnetic switching cell design and characterization for WBG power semiconductors
2020 · Kirill Klein, Eckart Hoene, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)
Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies
2019 · Piotr Mackowiak, Kolja Erbacher, et al. · International Conference on Developments in eSystems Engineering (DeSE)
高次仮想接地フェンスを用いた電力平面フィルタ【Powered by NICT】
2017 · Engin A. Ege, Ndip Ivan, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology
Development of a Novel High Reliable Si-Based Trace Humidity Sensor Array for Aerospace and Process Industry
2016 · Shuyao Zhou, Quoc Cuong Dao, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)
クーロメトリー法を用いた新しいシリコンベース微量湿度センサのためのパッケージング解【Powered by NICT】
2016 · Piotr Mackowiak, Biswajit Mukhopadhyay, et al. · IEEE Conference Proceedings
エレクトロニクスの陳腐化‐スマートフォンの例【Powered by NICT】
2016 · Marina Proske, Winzer Janis, et al. · IEEE Conference Proceedings
ICTのエネルギー効率:カスタマイズされた製品による更なる改善【Powered by NICT】
2016 · Lutz Stobbe, Marina Proske, et al. · IEEE Conference Proceedings
電子製品のライフサイクル条件を測定するための指示装置の開発【Powered by NICT】
2016 · Winzer Janis, Wagner Eduard, et al. · IEEE Conference Proceedings
自動車電子制御装置のための高温度動作耐久試験を加速するための革新的アプローチ【Powered by NICT】
2016 · Youssef Abdalla, Birner Ingo, et al. · IEEE Conference Proceedings
高周波プリント配線ボード積層板の誘電材料の特性化とその送電線の高周波損失の解析【Powered by NICT】
2016 · Brian Curran, Christian Tschoban, et al. · IEEE Conference Proceedings
ファンアウトパネルレベルパッケージングの可能性と挑戦【Powered by NICT】
2016 · Braun Tanja, Becker Karl-Friedrich, et al. · IEEE Conference Proceedings
グリーンエレクトロニクス研究動向のレビュー【Powered by NICT】
2016 · F Nissen Nils, Lutz Stobbe, et al. · IEEE Conference Proceedings
場におけるスマートフォンおよび錠剤のリチウムイオン電池の耐久性とサイクル頻度【Powered by NICT】
2016 · Christian Clemm, Sinai Christoph, et al. · IEEE Conference Proceedings
Works count: 37
Citation count: 83
H-index: 6
I10-index: 3
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