ファンアウトパネルレベルパッケージングの可能性と挑戦【Powered by NICT】
Year: 2016
Type: conference-paper
Source: IEEE Conference Proceedings
Language: Japanese
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2747712271