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Matthew Parlee
Observed names:
M. Parlee,
M. R. Parlee
Institution:
Northrop Grumman (United States)
Observed institution:
Northrop Grumman (United States)
OpenAlex ID:
A5040201138
Advanced Heterogeneous Integration of InP HBT and CMOS Si Technologies
2010
·
Augusto Gutierrez-Aitken
, Patty Chang-Chien
, et al.
·
Technical digest -- IEEE Compound Semiconductor Integrated Circuit Symposium
·
22
Advanced heterogeneous integration of InP HBT and CMOS Si technologies for high performance mixed signal applications
2009
·
Augusto Gutierrez-Aitken
, Patty Chang-Chien
, et al.
·
IEEE MTT-S International Microwave Symposium digest
·
15
Incorporation of BCB into Wafer-Scale Assembly MMIC's
2010
·
David M. Eaves
, Patty Chang-Chien
, et al.
·
ECS Transactions
·
4
Multilayer W-Band Transmit Elements for Scalable Millimeter-Wave Arrays
2007
·
R. Tsai
, D. Duan
, et al.
·
Technical digest -- IEEE Compound Semiconductor Integrated Circuit Symposium
·
3
Incorporation of BCB into Wafer-Scale Assembly MMIC's
2010
·
David M. Eaves
, Patty Chang-Chien
, et al.
·
ECS Meeting Abstracts
·
1
PDF
Manufacturable tri-stack AlSb/INAS HEMT low-noise amplifiers using wafer-level-packaging technology for light-weight and ultralow-power applications
2009
·
Y. C. Chou
, P. Chang-Chien
, et al.
·
Conference proceedings. ... International Conference on Indium Phosphide and Related Materials
Reliability evaluation of hermetic GaAs HEMT MMICs using wafer-scale-assembly technology for compact and light-weight applications
2009
·
Y.C. Chou
, P. Chang-Chien
, et al.
Reliability evaluation of wafer-level-packaging AlSb/InAs HEMT receivers for light-weight and ultralow-power applications
2008
·
Y. Chou
, P. Chang-Chien
, et al.
·
Reliability of Compound Semiconductors Workshop (ROCS)
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Works count:
8
Citation count:
45
H-index:
3
I10-index:
2
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