Incorporation of BCB into Wafer-Scale Assembly MMIC's
Year: 2010
Type: conference-paper
Source: ECS Transactions
DOI: 10.1149/1.3372609
Authors: David M. Eaves, Patty Chang-Chien, Wen-Ben Luo, David Farkas, Xianglin Zeng, Raffi Elmadjian, Danny Li, Linh Dang, Kelly Hennig, Chi Cheung, Xing Lan, Michael Battung, Wendy Lee, Matthew Parlee, Jansen Uyeda, Michael Barsky
Institution: Northrop Grumman (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2320242522