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Barbara Pahl

Carbon nanotubes for nanoscale low temperature flip chip connections
2009 · Sascha Hermann, Barbara Pahl, et al. · Microelectronic Engineering · 39
Embedding and assembly of ultrathin chips in multilayer flex boards
2008 · W. Christiaens, T. Loeher, et al. · Circuit World · 33
Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation
2022 · Anna Pak, Kambiz Nanbakhsh, et al. · Micromachines · 20
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Long time reliability study of soldered flip chips on flexible substrates
2003 · Barbara Pahl, Christine Kallmayer, et al. · Microelectronics Reliability · 18
Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants
2019 · Kambiz Nanbakhsh, Marta Kluba, et al. · Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) · 17
Highly integrated flexible electronic Circuits and Modules
2008 · Thomas Loher, Manuel Seckel, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 13
Thermoplastic packaging and embedding technology for ID-cards
2013 · Joao Marques, Barbara Pahl, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 10
Current loadability of ICA for flip chip applications
2002 · J. Haberland, B. Pahl, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 6
Ultrathin Assemblies on Flexible Substrates
2006 · B. Pahl, C. Kallmayer, et al. · Electronic Packaging Technology Conference · 5
Ultrathin soldered flip chip interconnections on flexible substrates
2004 · B. Pahl, T. Loeher, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
A thermode bonding process for fine pitch flip chip applications down to 40 micron
2002 · B. Pahl, S. Nieland, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 5
Thermoplastic based system-in-package for RFID application
2013 · Christine Kallmayer, Barbara Pahl, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
Development of a scalelable interconnection technology for nano packaging
2005 · Becker, K.-F., Löher, T., et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 2
Heterogeneous integration – packaging on and in organic substrates
2011 · Karl-F. Becker, T. Braun, et al. · IMAPSource Proceedings · 1
Thermoplastic polyurethane as a base material for soft, high-density neural interfaces
2026 · Anna Pak, Andrada Iulia Velea, et al. · bioRxiv (Cold Spring Harbor Laboratory)
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Handheld ultrasound inspection system for position-resolved 3D imaging on arbitrary surfaces
2026 · Florian Römer, Ute Rabe, et al. · e-Journal of Nondestructive Testing
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Handheld Ultrasound Inspection System for Position Resolved 3D Imaging on Arbitrary Surfaces
2026 · Römer, Florian, Rabe, Ute, et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft)
Recommendations for sustainable and circular electronics from the Sustronics project
2026 · Hakola, Liisa, de Kok, Margreet, et al. · Zenodo (CERN European Organization for Nuclear Research)
Fine Pitch Flip Chip Attach to a Flexible Carrier
2008 · Charles G. Woychik, Rayette Fisher, et al. · SMTA International
Nano-structured Interconnects for System Integration
2006 · R. Aschenbrenner, S. Fiedler, et al. · International Conference on Electronic Materials and Packaging
Long time reliability of flip chip interconnections on flexible substrates
2002 · Pahl, B., Kallmayer, C., et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)
Works count: 36
Citation count: 181
H-index: 7
I10-index: 7
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